1. frequency technologies are also increasing continually.

1.  IntroductionFraunhofer IFAM:The Institute Fraunhofer Institute for Manufacturing Technology and AdvancedMaterials IFAM is one of the leading research institute in Europe adhesive bondingtechnology, surfaces, shaping and functional materials. IFAM is located in fivemajor cities in Germany namely, Bremen, Dresden, Oldenburg, Stade and Wolfsburg.IFAM consists of more than 600 employees working in 23 departments. Their corecompetencies includes Powder Technology; Sintered, Composite, and CellularMetallic Materials; Adhesive Bonding Technology; Surface Technology; CastingTechnology; Electrical Components and Systems; and Fibre Reinforced Plastics. IFAM provides products,process and technical solution to sectors aviation industry, automotive sector,energy and environment, medical technology and life sciences.

IFAM Dresden branch is specialised in composite,gradient materials, functional materials and highly porous metal. Generalstate of the technology:  Inthe recent times mobile phones, wireless communication technology fortransmitting text and image data is constantly making rapid progress. At the sametime, applications for broadband and high frequency technologies are alsoincreasing continually.  For furtherprogress in high frequency wireless communication technologies, mobile terminaldevices should be equipped with multiple functions such as Bluetooth, GPS, andwireless LAN. This in turn results in Increasing the circuit size.  To overcome this, it is desirable to buildthe various high frequency functions and passive components into the substrate itselfrather than mounting them on its surface.

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 LTCC MultilayerLow temperature co-fired ceramics (LTCC) is an well-established technology toproduce highly integrated components and module for broadband and highfrequency technologies. It can be integrated with passive circuits and 3-dimensionalstructures as well as to act as a reliable platform for integrated circuit (IC)assembly. In addition to its excellent integration capacity, it’s possible to combinematerials with different electrical properties in one substrate to producemulti-material modules.  LTCC Manufacturingissues On theother hand, there are many technical and industrial challenges still to overcomebefore complex LTCC modules with three dimensional structures and integratedfunctional materials can be efficiently produced.


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